The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Sep. 10, 2018
Applicant:

Jsr Corporation, Minato-ku, JP;

Inventors:

Isao Nishimura, Minato-ku, JP;

Nobuyuki Miyaki, Minato-ku, JP;

Toshiaki Kadota, Minato-ku, JP;

Shintarou Fujitomi, Minato-ku, JP;

Tomotaka Shinoda, Minato-ku, JP;

Assignee:

JSR CORPORATION, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01); H05K 3/38 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H05K 1/0242 (2013.01); H05K 3/285 (2013.01); H05K 3/38 (2013.01); H05K 1/0237 (2013.01); H05K 1/0313 (2013.01); H05K 1/0393 (2013.01); H05K 1/11 (2013.01);
Abstract

The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).


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