The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Feb. 21, 2018
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Makoto Urushihara, Amagasaki, JP;

Yasuhiko Kudo, Amagasaki, JP;

Shintaro Iida, Amagasaki, JP;

Hideaki Sakurai, Amagasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); C09D 179/08 (2006.01); H01F 41/066 (2016.01); H01F 5/06 (2006.01); C09D 5/44 (2006.01); H01B 7/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/32 (2013.01); C09D 5/44 (2013.01); C09D 179/08 (2013.01); H01B 7/02 (2013.01); H01F 5/06 (2013.01); H01F 41/066 (2016.01);
Abstract

There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t) (including that t=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.


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