The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jul. 23, 2020
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Syu-Tang Liu, Kaohsiung, TW;

Huang-Hsien Chang, Kaohsiung, TW;

Yunghsun Chen, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 27/32 (2006.01); H01F 27/40 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H01F 41/04 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/24 (2013.01); H01F 27/324 (2013.01); H01F 27/40 (2013.01); H01F 41/041 (2013.01); H05K 1/18 (2013.01); H05K 3/30 (2013.01); H05K 3/46 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.


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