The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

May. 23, 2022
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Tetsuya Namegawa, Tokyo, JP;

Manabu Hoshino, Tokyo, JP;

Shinichi Omiya, Tokyo, JP;

Takayuki Kagaya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 38/00 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/54 (2006.01); C21D 1/18 (2006.01); C21D 6/00 (2006.01); C21D 8/02 (2006.01); C22C 38/16 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01);
U.S. Cl.
CPC ...
C22C 38/54 (2013.01); C21D 1/18 (2013.01); C21D 6/004 (2013.01); C21D 8/0226 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/16 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C21D 2211/001 (2013.01);
Abstract

A nickel-containing steel for low temperature according to an aspect of the present invention has a chemical composition within a predetermined range, in which a metallographic structure of a thickness middle portion contains 2.0 vol % to 20.0 vol % of an austenite phase, an average grain size of prior austenite grains is 3.0 μm to 15.0 μm, an average aspect ratio of the prior austenite grains is 1.0 to 2.4, a plate thickness is 4.5 mm to 30 mm, the chemical composition and the average grain size of the prior austenite grains are further limited depending on the plate thickness, a yield stress at room temperature is 460 MPa to 710 MPa, and a tensile strength at the room temperature is 560 MPa to 810 MPa.


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