logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11577269 B1

PDFFull Text
Date of Patent:
Feb. 14, 2023

Filed:

Feb. 26, 2018

Workpiece processing apparatus using workpiece having reference marks, workpiece processing method, and computer storage medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Wataru Yoshitomi, Kumamoto, JP;

Koutarou Onoue, Kumamoto, JP;

Yasushi Kuranaga, Kumamoto, JP;

Kazuki Tashima, Kumamoto, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Venjuris, P.C.

Primary Examiner:

Karl Kurple

Int. Cl.
CPC ...
B05D 1/26 (2006.01); B05B 12/08 (2006.01); B05B 12/12 (2006.01); B41J 11/42 (2006.01); H01L 23/544 (2006.01); B05C 11/00 (2006.01); B05C 11/10 (2006.01); B41J 11/46 (2006.01); H05B 33/10 (2006.01); B41J 25/00 (2006.01); G03F 9/00 (2006.01); B05C 5/02 (2006.01); G01B 11/00 (2006.01); G01B 11/14 (2006.01); B05C 13/00 (2006.01); H01L 51/00 (2006.01); B41J 29/393 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B05C 11/00 (2013.01); B05B 12/084 (2013.01); B05B 12/124 (2013.01); B05C 11/1021 (2013.01); B05D 1/26 (2013.01); B41J 11/46 (2013.01); B41J 25/001 (2013.01); H01L 23/544 (2013.01); H05B 33/10 (2013.01); B05C 5/02 (2013.01); B05C 11/1005 (2013.01); B05C 11/1015 (2013.01); B05C 13/00 (2013.01); B41J 2/04505 (2013.01); B41J 11/42 (2013.01); B41J 29/393 (2013.01); B41J 2029/3935 (2013.01); B41J 2202/09 (2013.01); B41J 2203/01 (2020.08); G01B 11/002 (2013.01); G01B 11/14 (2013.01); G03F 9/7084 (2013.01); H01L 51/0005 (2013.01);
Abstract

Disclosed is a workpiece processing apparatus that performs a predetermined processing on a workpiece. The workpiece processing apparatus includes: a workpiece table configured to place the workpiece thereon; a processor configured to process the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the processor; a position measuring device configured to measure a position of the movement mechanism; a detector configured to detect a position of the workpiece placed on the workpiece table; and a corrector configured to calculate a positional correction amount of the workpiece table based on a measurement result of the position measuring device and a detection result of the detector.

Find Patent Forward Citations

Loading…