The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

May. 19, 2021
Applicant:

Globalfoundries U.s. Inc., Malta, NY (US);

Inventors:

Alexander M. Derrickson, Saratoga Springs, NY (US);

Richard F. Taylor, III, Campbell, CA (US);

Mankyu Yang, Fishkill, NY (US);

Alexander L. Martin, Greenfield Center, NY (US);

Judson R. Holt, Ballston Lake, NY (US);

Jagar Singh, Clifton Park, NY (US);

Assignee:

GlobalFoundries U.S. Inc., Malta, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/082 (2006.01); H01L 27/12 (2006.01); H01L 29/78 (2006.01); H01L 21/84 (2006.01); H01L 21/8238 (2006.01); H01L 21/768 (2006.01); H01L 29/735 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/735 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 29/0808 (2013.01); H01L 29/0821 (2013.01); H01L 29/10 (2013.01); H01L 29/1008 (2013.01); H01L 29/6625 (2013.01); H01L 29/66325 (2013.01); H01L 29/7394 (2013.01);
Abstract

Disclosed is a semiconductor structure including at least one bipolar junction transistor (BJT), which is uniquely configured so that fabrication of the BJT can be readily integrated with fabrication of complementary metal oxide semiconductor (CMOS) devices on an advanced silicon-on-insulator (SOI) wafer. The BJT has an emitter, a base, and a collector laid out horizontally across an insulator layer and physically separated. Extension regions extend laterally between the emitter and the base and between the base and the collector and are doped to provide junctions between the emitter and the base and between the base and the collector. Gate structures are on the extension regions. The emitter, base, and collector are contacted. Optionally, the gate structures and a substrate below the insulator layer are contacted and can be biased to optimize BJT performance. Optionally, the structure further includes one or more CMOS devices. Also disclosed is a method of forming the structure.


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