The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Apr. 04, 2017
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Takayuki Aoyama, Kyoto, JP;

Shinichi Kato, Kyoto, JP;

Kazuhiko Fuse, Kyoto, JP;

Hikaru Kawarazaki, Kyoto, JP;

Masashi Furukawa, Kyoto, JP;

Hideaki Tanimura, Kyoto, JP;

Akitsugu Ueda, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/48 (2006.01); H01L 21/263 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); C23C 16/4412 (2013.01); C23C 16/45557 (2013.01); C23C 16/482 (2013.01); H01L 21/02164 (2013.01); H01L 21/02337 (2013.01); H01L 21/265 (2013.01); H01L 21/2636 (2013.01); H01L 21/67248 (2013.01); H01L 29/78 (2013.01);
Abstract

A semiconductor wafer to be treated is heated at a first preheating temperature ranging from 100 to 200° C. while a pressure in a chamber housing the semiconductor wafer is reduced to a pressure lower than an atmospheric pressure. After the semiconductor wafer is preheated to increase the temperature into a second preheating temperature ranging from 500 to 700° C. while the pressure in the chamber is restored to a pressure higher than the reduced pressure, a flash lamp emits a flashlight to a surface of the semiconductor wafer. Heating the semiconductor wafer at the first preheating temperature that is a relatively low temperature enables, for example, the moisture absorbed on the surface of the semiconductor wafer in trace amounts to be desorbed from the surface, and also enables the flash heating treatment to be performed with oxygen derived from such absorption removed as much as possible.


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