The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Sep. 25, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Katalin Klara Bartfai-Walcott, El Dorado Hills, CA (US);

Arkadiusz Berent, Tuchom, PL;

Vasuki Chilukuri, Hillsboro, OR (US);

Mark Baldwin, Hillsboro, OR (US);

Vasudevan Srinivasan, Portland, OR (US);

Vinila Rose, Cupertino, CA (US);

Mariusz Oriol, Gdynia, PL;

Justyna Chilczuk, Gdansk, PL;

Bartosz Gotowalski, Gdansk, PL;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/50 (2006.01); G06F 21/73 (2013.01); G06F 21/10 (2013.01); G06F 21/72 (2013.01); G06Q 20/12 (2012.01); G06Q 10/10 (2012.01); G06Q 30/06 (2012.01); G06Q 50/18 (2012.01); H04L 9/08 (2006.01); H04L 9/32 (2006.01); G06Q 30/00 (2012.01); G06Q 50/04 (2012.01);
U.S. Cl.
CPC ...
G06F 9/5027 (2013.01); G06F 21/105 (2013.01); G06F 21/72 (2013.01); G06F 21/73 (2013.01); G06Q 10/10 (2013.01); G06Q 20/127 (2013.01); G06Q 20/1235 (2013.01); G06Q 30/0609 (2013.01); G06Q 50/184 (2013.01); H04L 9/0861 (2013.01); H04L 9/321 (2013.01); H04L 9/3263 (2013.01); H04L 9/3268 (2013.01); G05B 2219/2205 (2013.01); G05B 2219/25395 (2013.01); G05B 2219/33088 (2013.01); G06F 2209/501 (2013.01); G06F 2209/504 (2013.01); G06F 2209/506 (2013.01); G06F 2221/0704 (2013.01); G06F 2221/2149 (2013.01); G06Q 30/0185 (2013.01); G06Q 50/04 (2013.01); G06Q 2220/18 (2013.01); H04L 9/3278 (2013.01);
Abstract

Methods, apparatus, systems and articles of manufacture (e.g., physical storage media) to implement and manage software defined silicon products are disclosed. Example semiconductor devices disclosed herein include circuitry configurable to provide one or more features. Disclosed example semiconductor devices also include a license processor to activate or deactivate at least one of the one or more features based on a license received via a network from a first remote enterprise system. Disclosed example semiconductor devices further include an analytics engine to report telemetry data associated with operation of the semiconductor device to at least one of the first remote enterprise system or a second remote enterprise system, the analytics engine to report the telemetry data in response to activation or deactivation of the at least one of the one or more features based on the license.


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