The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

May. 29, 2020
Applicant:

John Bean Technologies Corporation, Chicago, IL (US);

Inventors:

David Pfanstiel, Canton, GA (US);

Daniel Holmes, Atlanta, GA (US);

Richard D. Stockard, Kirkland, WA (US);

Arthur W. Vogeley, Jr., Lynnwood, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A22C 17/00 (2006.01); G06T 7/62 (2017.01); B26D 5/00 (2006.01); B26D 7/06 (2006.01); B26F 3/00 (2006.01); G01B 11/06 (2006.01); G01B 15/02 (2006.01); G01N 23/083 (2018.01); G01N 33/12 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
A22C 17/0086 (2013.01); B26D 5/007 (2013.01); B26D 7/0625 (2013.01); B26F 3/004 (2013.01); G01B 11/06 (2013.01); G01B 15/02 (2013.01); G01N 23/083 (2013.01); G01N 33/12 (2013.01); G06T 7/0004 (2013.01); G06T 7/62 (2017.01); B26D 2210/02 (2013.01); G06T 2207/10116 (2013.01); G06T 2207/30128 (2013.01);
Abstract

A processing system () and a corresponding method are provided for processing work products (WP), including food items, to locate and quantify voids, undercuts and similar anomalies in the work products. The work products are conveyed past an X-ray scanner () by a conveyance device (). Data from the X-ray scanning is transmitted to control system (). Simultaneously with the X-ray scanning of the work product, the work product is optically scanned at the same location on the work product where X-ray scanning is occurring. The data from the optical scanner is also transmitted to the control system. Such data is analyzed to develop or generate the thickness profile of the work product. From the differences in the thickness profiles generated from the X-ray scanning data versus the optical scanning data, the location of voids, undercuts and similar anomalies can be determined by the control system. This information is used by the processing system () to process the work product as desired, including adjusting for the locations and sizes of voids, undercuts and similar anomalies present in the work product.


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