The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Dec. 17, 2020
Applicant:

Silanna Uv Technologies Pte Ltd, Singapore, SG;

Inventors:

Guilherme Tosi, Yeerongpilly QLD, AU;

Norbert Krause, Hawthorne QLD, AU;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/06 (2010.01); H01L 33/10 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0025 (2013.01); H01L 33/06 (2013.01); H01L 33/10 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01);
Abstract

In some embodiments, a semiconductor structure comprises a semiconductor layer, a metal layer, and a contact layer adjacent to the metal layer, and between the semiconductor layer and the metal layer. The contact layer can comprise one or more piezoelectric materials comprising spontaneous piezoelectric polarization that depends on material composition and/or strain, and a region comprising a gradient in materials composition and/or strain adjacent to the metal layer. In some embodiments, a light emitting diode (LED) device comprises an n-doped short period superlattice (SPSL) layer, an intrinsically doped AlN/GaN SPSL layer adjacent to the n-doped SPSL layer, a metal layer, and an ohmic-chirp layer between the metal layer and the intrinsically doped AlN/GaN SPSL layer.


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