Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device

Abstract

First p-type regions are provided directly beneath trenches, separate from a p-type base region and facing bottoms of the trenches in a depth direction. The first p-type regions are exposed at the bottoms of the trenches and are in contact with a gate insulating film at the bottoms of the trenches. Second p-type regions are each provided between (mesa region) adjacent trenches, separate from the first p-type regions and the trenches. Drain-side edges of the second p-type regions are positioned closer to a source side than are drain-side edges of the first p-type regions. In each mesa region, an n-type region is provided separate from the first p-type regions and the trenches. The n-type regions are adjacent to and face the second p-type regions in the depth direction.