The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Sep. 29, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Janggn Yun, Hwaseong-si, KR;

Jaeduk Lee, Seongnam-si, KR;

Dongwhee Kwon, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/24 (2006.01); H01L 23/535 (2006.01); H01L 27/11556 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 23/535 (2013.01); H01L 27/11556 (2013.01); H01L 27/249 (2013.01); H01L 27/2454 (2013.01);
Abstract

A semiconductor device includes a first stacked structure and a second stacked structure spaced apart from each other on a substrate, and a plurality of separation structures and a plurality of vertical memory structures alternately arranged between the first stacked structure and the second stacked structure in a first direction parallel to an upper surface of the substrate. Each of the first and second stacked structures includes a plurality of interlayer insulating layers and a plurality of gate layers alternately repeatedly stacked on the lower structure. Each of the vertical memory structures includes a first data storage structure facing the first stacked structure and a second data storage structure facing the second stacked structure. Side surfaces of the first and second stacked structures facing the vertical memory structures are concave in a plan view.


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