The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Mar. 01, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sanghyun Lee, Cheonan-si, KR;
Juhyun Lyu, Cheonan-si, KR;
Unbyoung Kang, Hwaseong-si, KR;
Chulwoo Kim, Incheon, KR;
Jongho Lee, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip mounted on the package substrate, a second semiconductor mounted on the package substrate and set apart from the first semiconductor chip in a horizontal direction thereby forming a gap between the first semiconductor chip and the second semiconductor chip. The semiconductor package further includes a first thermal interface material layer formed in the gap and having a first modulus of elasticity and a second thermal interface material layer formed on each of the first semiconductor chip and the second semiconductor chip and having a second modulus of elasticity, wherein the first modulus of elasticity is less than the second modulus of elasticity.