The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Nov. 30, 2018
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Tetsuya Kato, Tomioka, JP;

Yohei Mizuno, Tomioka, JP;

Chiharu Ishikura, Tomioka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/14 (2006.01); C22F 1/00 (2006.01); C22F 1/14 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3426 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/3414 (2013.01); C22F 1/00 (2013.01); C22F 1/14 (2013.01);
Abstract

A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 μm or more and 200 μm or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.


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