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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11567405 B1

PDFFull Text
Date of Patent:
Jan. 31, 2023

Filed:

Nov. 20, 2019

Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Takeshi Kawabata, Shizuoka, JP;

Kenta Yoshida, Shizuoka, JP;

Yu Iwai, Shizuoka, JP;

Akinori Shibuya, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
G03F 7/037 (2006.01); G03F 7/004 (2006.01); C08G 73/10 (2006.01); C08G 73/22 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01);
U.S. Cl.
CPC ...
G03F 7/037 (2013.01); C08G 73/1067 (2013.01); C08G 73/22 (2013.01); G03F 7/0045 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/325 (2013.01); G03F 7/38 (2013.01);
Abstract

A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

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