The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Oct. 09, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Keiji Nomaru, Tokyo, JP;

Yuji Hadano, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/146 (2014.01); B23K 26/0622 (2014.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/142 (2014.01); B23K 26/064 (2014.01); H01L 21/67 (2006.01); B23K 103/00 (2006.01); B23K 101/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/146 (2015.10); B23K 26/064 (2015.10); B23K 26/0608 (2013.01); B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); B23K 26/0665 (2013.01); B23K 26/08 (2013.01); B23K 26/142 (2015.10); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); B23K 2101/18 (2018.08); B23K 2103/56 (2018.08);
Abstract

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.


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