The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Dec. 19, 2017
Rogers Germany Gmbh, Eschenbach, DE;
Andreas Meyer, Wenzenbach, DE;
Vitalij Gil, Hersbruck, DE;
László Müller, Nuremberg, DE;
Rainer Herrmann, Warmensteinach, DE;
Stefan Britting, Schnaittach, DE;
ROGERS GERMANY GMBH, Eschenbach, DE;
Abstract
The present invention proposes a carrier substrate () for electrical components (), the carrier substrate () having a component side () and a cooling side () which is opposite the component side () and has a cooling structure (), the carrier substrate () comprising a primary layer () which faces the component side () and is produced from ceramic for electrical insulation, and a secondary layer () which faces the cooling side () for stiffening the carrier substrate (), characterized in that a metallic intermediate layer () is arranged between the primary layer () and the secondary layer () for heat transfer from the component side () to the cooling side (), the metallic intermediate layer () being thicker than the primary layer () and/or the secondary layer ().