The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Apr. 06, 2018
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Kentaro Furue, Tokyo, JP;

Yuki Miyaishi, Tokyo, JP;

Shiyuko Nakamura, Tokyo, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/20 (2006.01); G03F 7/032 (2006.01); H05B 33/10 (2006.01); H05B 33/22 (2006.01);
U.S. Cl.
CPC ...
G03F 7/023 (2013.01); G03F 7/032 (2013.01); G03F 7/2016 (2013.01); H05B 33/10 (2013.01); H05B 33/22 (2013.01);
Abstract

A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as 'trivalent or greater phenol compound', and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). Rto Rand * in the formulas are as defined in the Specification.


Find Patent Forward Citations

Furue, Kentaro. (2023). Photosensitive resin composition (U.S. Patent No. 11561469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11561469

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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