The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
May. 18, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Timothy Joseph Franklin, Campbell, CA (US);
Adam Fischbach, Campbell, CA (US);
Edward Haywood, Santa Clara, CA (US);
Abhijit B. Mallick, Fremont, CA (US);
Pramit Manna, Santa Clara, CA (US);
Carlaton Wong, Sunnyvale, CA (US);
Stephen C. Garner, Newark, CA (US);
Eswaranand Venkatasubramanian, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); H01J 37/32 (2006.01); C23C 16/46 (2006.01); C23C 16/50 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4584 (2013.01); C23C 16/45565 (2013.01); C23C 16/46 (2013.01); C23C 16/50 (2013.01); H01J 37/3244 (2013.01); H01J 37/32522 (2013.01); H01J 37/32715 (2013.01); H01J 2237/3321 (2013.01); H01L 21/02115 (2013.01); H01L 21/02274 (2013.01); H01L 21/0332 (2013.01);
Abstract
Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.