The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Jun. 18, 2019
Applicant:
Versum Materials Us, Llc, Tempe, AZ (US);
Inventor:
Dnyanesh C. Tamboli, Tempe, AZ (US);
Assignee:
VERSUM MATERIALS US, LLC, Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 1/00 (2006.01); C11D 3/30 (2006.01); C11D 3/37 (2006.01); C11D 3/20 (2006.01); C11D 1/22 (2006.01); C11D 3/22 (2006.01); H01L 21/02 (2006.01); C11D 1/02 (2006.01);
U.S. Cl.
CPC ...
C11D 3/2079 (2013.01); C11D 1/22 (2013.01); C11D 3/2082 (2013.01); C11D 3/2086 (2013.01); C11D 3/225 (2013.01); C11D 3/3707 (2013.01); C11D 3/378 (2013.01); H01L 21/02065 (2013.01); H01L 21/02074 (2013.01); C11D 1/02 (2013.01);
Abstract
Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH<7 and optionally a surfactant with two sulfonic acid groups.