The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Aug. 20, 2021
Ibiden Co., Ltd., Gifu, JP;
Haruhiko Morita, Ogaki, JP;
Hitoshi Miwa, Ogaki, JP;
Shinobu Kato, Ogaki, JP;
Toshihiko Yokomaku, Ogaki, JP;
Hisashi Kato, Ogaki, JP;
Takahisa Hirasawa, Ogaki, JP;
Tetsuya Muraki, Ogaki, JP;
Takayuki Furuno, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.