The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Oct. 06, 2020
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventor:
Jinbang Tang, Chandler, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 23/49513 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2413 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24246 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/9201 (2013.01); H01L 2224/92137 (2013.01); H01L 2224/92244 (2013.01);
Abstract
A method of forming a semiconductor device includes attaching a semiconductor die to a flag of a leadframe and forming a conductive connector over a portion of the semiconductor die and a portion of the flag. A conductive connection between a first bond pad of the semiconductor die and the flag is formed by way of the conductive connector. A second bond pad of the semiconductor die is connected to a conductive lead of the plurality by way of a bond wire.