The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Apr. 15, 2019
Applicant:
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
Inventors:
Minoru Ida, Tokyo, JP;
Yuta Shiratori, Tokyo, JP;
Assignee:
NIPPON TELEGRAPH AND TELEPHONE CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/36 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/647 (2013.01); H01L 21/4846 (2013.01); H01L 23/36 (2013.01); H01L 23/53242 (2013.01);
Abstract
An integrated circuit includes a resistive material layer formed on a substrate, a metal layer formed on the resistive material layer, a bipolar transistor formed on the substrate, and a resistive element formed on the substrate. The bipolar transistor includes, as a sub-layer, the metal layer formed in a first region, and also includes a collector layer formed on the sub-collector layer. The resistive element is constituted by the resistive material layer formed in a second region.