The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Oct. 04, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chih-Chao Yang, Glenmont, NY (US);

Daniel Charles Edelstein, White Plains, NY (US);

Chao-Kun Hu, Somers, NY (US);

Oscar van der Straten, Guilderland Center, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/24 (2006.01); H01L 21/324 (2006.01); H01L 21/04 (2006.01); H01L 21/304 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/246 (2013.01); H01L 21/049 (2013.01); H01L 21/304 (2013.01); H01L 21/3245 (2013.01); H01L 21/76849 (2013.01); H01L 21/76877 (2013.01);
Abstract

An electrode structure with an alloy interface is provided. In one aspect, a method of forming a contact structure includes: patterning a via in a first dielectric layer; depositing a barrier layer onto the first dielectric layer, lining the via; depositing and polishing a first metal layer (Element A) into the via to form a contact in the via; depositing a second metal layer (Element B) onto the contact in the via; annealing the first and second metal layers under conditions sufficient to form an alloy AB; depositing a third metal layer onto the second metal layer; patterning the second and third metal layers into a pedestal stack over the contact to form an electrode over the contact, wherein the alloy AB is present at an interface of the electrode and the contact; and depositing a second dielectric that surrounds the pedestal stack. A contact structure is also provided.


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