The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Jul. 07, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Vikrant Upadhyaya, Kanagawa, JP;

Tsuneo Abe, Kanagawa, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/3185 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
G01R 1/067 (2013.01); G01R 31/26 (2013.01); G01R 31/318511 (2013.01);
Abstract

A testing probe system includes probes configured to contact shared probe pads of multi-channel die of a wafer; and a controller configured to generate testing patterns and receive signals from the multi-channel die of the wafer. The controller is configured to contact a probe of the probes with a shared probe pad of the multi-channel die, select a first channel of the multi-channel die to test, select at least one test mode for testing the first channel, stimulate at least the first channel during a single contact period, acquiring a first output of the first channel during the single contact period, select a second channel of the multi-channel die to test, select at least one test mode for testing the second channel, stimulate at least the second channel during the single contact period, and acquire a second output of the first channel during the single contact period.


Find Patent Forward Citations

Upadhyaya, Vikrant. (2023). Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods (U.S. Patent No. 11555828). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11555828

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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