The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Jun. 22, 2021
Applicants:

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Garuda Technology Co., Ltd., New Taipei, TW;

Inventors:

Yin-Ju Chen, New Taipei, TW;

Jing-Cyuan Yang, New Taipei, TW;

Yen-Chang Chu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/38 (2006.01); H05K 1/02 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H05K 3/4676 (2013.01); H05K 3/388 (2013.01); B82Y 40/00 (2013.01); H05K 1/0209 (2013.01); H05K 2201/026 (2013.01);
Abstract

A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.


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Chen, Yin-Ju. (2023). Method for manufacturing circuit board with heat dissipation function (U.S. Patent No. 11553602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11553602

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