The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jun. 09, 2021
Disco Corporation, Tokyo, JP;
Tasuku Koyanagi, Tokyo, JP;
Junya Mimura, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A lift-off method includes a relocation substrate joining step of joining a relocation substrate to a surface of an optical device layer of an optical device wafer with a joining member interposed therebetween, thereby forming a composite substrate, a buffer layer breaking step of applying a pulsed laser beam having a wavelength transmittable through an epitaxy substrate and absorbable by a buffer layer to the buffer layer from a reverse side of the epitaxy substrate of the optical device wafer of the composite substrate, thereby breaking the buffer layer, and an optical device layer relocating step of peeling off the epitaxy substrate from the optical device layer, thereby relocating the optical device layer to the relocation substrate. In the buffer layer breaking step, irradiating conditions of the pulsed la-ser beam are changed for respective ring-shaped areas of the buffer layer, and the pulsed laser beam is applied to the optical device wafer under the changed irradiating conditions.