The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Nov. 04, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Sho Tanaka, Tokyo, JP;

Tomohide Terashima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H03K 17/082 (2006.01); H02H 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0292 (2013.01); H01L 27/0255 (2013.01); H01L 27/0259 (2013.01); H01L 27/0266 (2013.01); H01L 27/0288 (2013.01); H02H 9/025 (2013.01); H03K 17/0828 (2013.01);
Abstract

A semiconductor device includes a main IGBT, a sense, a resistor, a MOSFET and a diode, as main components. The sense IGBT and the main IGBT are connected in parallel with each other. The drain of MOSFET is connected to the gate of the sense IGBT, the source thereof is connected to the gate of the main IGBT, and the gate thereof is connected to the emitter of the sense IGBT and the cathode of diode. One end of the resistor is connected to the gate of the main IGBT and the source of the MOSFET, and the other end of the resistor is connected to the emitter of the main IGBT and the anode of the diode.


Find Patent Forward Citations

Loading…