The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Apr. 19, 2021
Applicant:
Shinko Electric Industries, Co., Ltd., Nagano, JP;
Inventors:
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-ken, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01R 9/00 (2006.01); H05K 7/18 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49524 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/4951 (2013.01); H01L 23/49558 (2013.01); H01L 23/49575 (2013.01);
Abstract
A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.