The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Feb. 14, 2020
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Wei Ling Ma, Kaohsiung, TW;
Ying-Chung Chen, Kaohsiung, TW;
Hsin-Ying Ho, Kaohsiung, TW;
Cheng-Ling Huang, Kaohsiung, TW;
Chang Chin Tsai, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/18 (2010.01); H01L 21/82 (2006.01); H01L 21/683 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/82 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.