The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Oct. 29, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Kuo-Chiang Tsai, Hsinchu, TW;

Yi-Ju Chen, Tainan, TW;

Jyh-Huei Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 27/02 (2006.01); H01L 29/417 (2006.01); H01L 29/08 (2006.01); H01L 29/78 (2006.01); H01L 21/8234 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76816 (2013.01); H01L 21/823431 (2013.01); H01L 21/823475 (2013.01); H01L 23/5226 (2013.01); H01L 27/0207 (2013.01); H01L 21/76897 (2013.01); H01L 21/823418 (2013.01); H01L 29/0847 (2013.01); H01L 29/41791 (2013.01); H01L 29/7848 (2013.01);
Abstract

An exemplary semiconductor device includes a source feature and a drain feature disposed over a substrate. The semiconductor device further includes a source via electrically coupled to the source feature, and a drain via electrically coupled to the drain feature. The source via has a first size; the drain via has a second size; and the first size is greater than the second size. The semiconductor device may further include a first metal line electrically coupled to the source via and a second metal line electrically coupled to the drain via. The source via has a first dimension matching a dimension of the first metal line, and the drain via has a second dimension matching a dimension of the second metal line. The first metal line may be wider than the second metal line.


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