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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11545421 B1

PDFFull Text
Date of Patent:
Jan. 03, 2023

Filed:

Jan. 28, 2021

Package including multiple semiconductor devices

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Jerome Teysseyre, Scottsdale, AZ (US);

Maria Cristina Estacio, Lapulapu, PH;

Seungwon Im, Seoul, KR;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Brake Hughes Bellermann LLP

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 23/49524 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 24/34 (2013.01); H01L 24/40 (2013.01); H01L 29/1608 (2013.01); H01L 2224/40111 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

In a general aspect, an apparatus can include an inner package including a first silicon carbide die having a die gate conductor coupled to a common gate conductor, and a second silicon carbide die having a die gate conductor coupled to the common gate conductor. The apparatus can include an outer package including a substrate coupled to the common gate conductor, and a clip coupled to the inner package and coupled to the substrate.

Find Patent Forward Citations

Teysseyre, Jerome. (2023). Package including multiple semiconductor devices (U.S. Patent No. 11545421). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11545421

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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