The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Jul. 17, 2019
Applicants:

Shennan Circuits Co., Ltd., Shenzhen, CN;

Radial Electronics;

Inventors:

Weijing Guo, Shenzhen, CN;

James Quilici, Shenzhen, CN;

Yuhua Zeng, Shenzhen, CN;

Hua Miao, Shenzhen, CN;

Assignees:

SHENNAN CIRCUITS CO., LTD., Shenzhen, CN;

RADIAL ELECTRONICS, El Dorado Hills, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 19/00 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 19/00 (2013.01); H01F 41/0206 (2013.01); H01F 41/041 (2013.01); H01F 2017/002 (2013.01);
Abstract

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.


Find Patent Forward Citations

Loading…