The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Oct. 28, 2019
Applicant:

Namics Corporation, Niigata, JP;

Inventors:

Irma Yolanda Kapoglis, Byfield, MA (US);

Masayoshi Otomo, Niigata, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 175/14 (2006.01); H01L 23/00 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 175/14 (2013.01); H01L 24/29 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29339 (2013.01);
Abstract

A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).


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