The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Mar. 30, 2018
Applicant:
Lintec Corporation, Tokyo, JP;
Inventor:
Masakazu Ishikawa, Tokyo, JP;
Assignee:
LINTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/29 (2018.01); C09J 7/30 (2018.01); B32B 7/12 (2006.01); B32B 29/00 (2006.01); B32B 37/12 (2006.01); C09J 11/04 (2006.01); B29C 65/04 (2006.01); B29C 65/14 (2006.01); B29C 65/36 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2013.01); B32B 29/002 (2013.01); B32B 37/1207 (2013.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); B29C 65/04 (2013.01); B29C 65/1425 (2013.01); B29C 65/3612 (2013.01); B29C 65/4815 (2013.01); B29C 65/4885 (2013.01); B29C 66/7332 (2013.01); B29C 66/73143 (2013.01); B32B 27/06 (2013.01); B32B 2255/12 (2013.01); C09J 2301/408 (2020.08);
Abstract
A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.