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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11542415 B1

PDFFull Text
Date of Patent:
Jan. 03, 2023

Filed:

Mar. 30, 2018

High-frequency dielectric heating adhesive sheet, and adhesion method in which same is used

Applicant:

Lintec Corporation, Tokyo, JP;

Inventor:

Masakazu Ishikawa, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
C09J 7/29 (2018.01); C09J 7/30 (2018.01); B32B 7/12 (2006.01); B32B 29/00 (2006.01); B32B 37/12 (2006.01); C09J 11/04 (2006.01); B29C 65/04 (2006.01); B29C 65/14 (2006.01); B29C 65/36 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2013.01); B32B 29/002 (2013.01); B32B 37/1207 (2013.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); B29C 65/04 (2013.01); B29C 65/1425 (2013.01); B29C 65/3612 (2013.01); B29C 65/4815 (2013.01); B29C 65/4885 (2013.01); B29C 66/7332 (2013.01); B29C 66/73143 (2013.01); B32B 27/06 (2013.01); B32B 2255/12 (2013.01); C09J 2301/408 (2020.08);
Abstract

A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.

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Ishikawa, Masakazu. (2023). High-frequency dielectric heating adhesive sheet, and adhesion method in which same is used (U.S. Patent No. 11542415). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11542415

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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