The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Nov. 01, 2018
Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Takashi Naito, Tokyo, JP;

Shinichi Tachizono, Tokyo, JP;

Kei Yoshimura, Tokyo, JP;

Yuji Hashiba, Tokyo, JP;

Hironori Suzuki, Tokyo, JP;

Taigo Onodera, Tokyo, JP;

Tatsuya Miyake, Tokyo, JP;

Akitoyo Konno, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/24 (2006.01); B32B 17/10 (2006.01); C03C 8/08 (2006.01); C03C 27/06 (2006.01); E06B 3/66 (2006.01); E06B 3/663 (2006.01); E06B 3/673 (2006.01); E06B 3/677 (2006.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); B32B 17/10036 (2013.01); B32B 17/10137 (2013.01); B32B 17/10614 (2013.01); C03C 8/08 (2013.01); C03C 27/06 (2013.01); E06B 3/6612 (2013.01); E06B 3/66304 (2013.01); E06B 3/66333 (2013.01); E06B 3/6733 (2013.01); E06B 3/6736 (2013.01); E06B 3/6775 (2013.01); E06B 2003/66338 (2013.01);
Abstract

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.


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