The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Oct. 22, 2019
Applicant:
Agc Inc., Tokyo, JP;
Inventors:
Assignee:
AGC INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/02 (2014.01); B23K 26/36 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); B23K 26/362 (2014.01); B23K 26/382 (2014.01); B23K 26/402 (2014.01); H01L 23/15 (2006.01); B23K 26/70 (2014.01); B23K 103/00 (2006.01); C03C 15/00 (2006.01); B23K 26/60 (2014.01);
U.S. Cl.
CPC ...
B23K 26/362 (2013.01); B23K 26/382 (2015.10); B23K 26/402 (2013.01); B23K 26/60 (2015.10); B23K 26/702 (2015.10); B23K 2103/54 (2018.08); C03C 15/00 (2013.01); H01L 23/15 (2013.01);
Abstract
A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.