The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Feb. 17, 2018
Applicant:

Analog Devices International Unlimited Company, Limerick, IE;

Inventors:

James G. Fiorenza, Carlisle, MA (US);

Susan L. Feindt, Andover, MA (US);

Michael D. Delaus, Andover, MA (US);

Matthew Duffy, Wilmington, MA (US);

Ryan Iutzi, Somerville, MA (US);

Kenneth Flanders, Reading, MA (US);

Rama Krishna Kotlanka, Belmont, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/62 (2010.01); B41F 16/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 33/32 (2013.01); H01L 33/62 (2013.01); B41F 16/00 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether () is formed on dice regions () of a first wafer (), followed by attachment of a second wafer () to the tethers. The dice regions () are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer ().


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