The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jun. 17, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chun-Wen Cheng, Zhubei, TW;

Chia-Hua Chu, Zhubei, TW;

Wen-Tuan Lo, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 7/10 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 7/16 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 7/10 (2013.01); B81B 3/0005 (2013.01); B81B 3/0021 (2013.01); B81C 1/00182 (2013.01); B81C 1/00968 (2013.01); H04R 7/16 (2013.01); H04R 19/04 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81C 2201/0133 (2013.01); B81C 2201/112 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone includes a substrate having an opening, a first diaphragm, a first backplate, a second diaphragm, and a backplate. The first diaphragm faces the opening in the substrate. The first backplate includes multiple accommodating-openings and it is spaced apart from the first diaphragm. The second diaphragm joints the first diaphragm together at multiple locations by pillars passing through the accommodating-openings in the first backplate. The first backplate is located between the first diaphragm and the second diaphragm. The second backplate includes at least one vent hole and it is spaced apart from the second diaphragm. The second diaphragm is located between the first backplate and the second backplate.


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