The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jun. 29, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Yi Huang, Shanghai, CN;

Fernando Gonzalez Lenero, Zapopan, MX;

Liwei Zhao, Shanghai, CN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01R 13/24 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 13/2414 (2013.01); H01R 12/7076 (2013.01); H01R 12/714 (2013.01);
Abstract

A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.


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