The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jul. 29, 2020
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Keiko Kawamura, Yokohama Kanagawa, JP;

Tomoko Matsudai, Shibuya Tokyo, JP;

Yoko Iwakaji, Meguro Tokyo, JP;

Kaori Fuse, Yokohama Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/45 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/732 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0657 (2013.01); H01L 29/45 (2013.01); H01L 29/7393 (2013.01);
Abstract

A semiconductor device has a cell part and a terminal part set in the device. The terminal part encloses the cell part. The semiconductor device includes a first electrode, a first semiconductor layer of a first conductive type, a second semiconductor layer of a second conductive type, and an insulating layer. The first semiconductor layer is formed above the first electrode. The second semiconductor layer is provided in an upper portion of the first semiconductor layer, and has an impurity concentration profile along a vertical direction including a plurality of peaks. The insulating layer is provided on the second semiconductor layer.


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