The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Jan. 28, 2021
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chi-Jen Chen, Taichung, TW;
Hsi-Chang Hsu, Taichung, TW;
Yuan-Hung Hsu, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
Don-Son Jiang, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.