The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Oct. 02, 2017
Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Shuhei Shigaki, Toyama, JP;

Satoshi Takeda, Toyama, JP;

Wataru Shibayama, Toyama, JP;

Makoto Nakajima, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); G03F 7/11 (2006.01); G03F 7/40 (2006.01); G03F 7/20 (2006.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01); C09D 183/04 (2006.01); C08G 77/18 (2006.01); C08G 77/24 (2006.01); C08G 77/20 (2006.01); G03F 7/075 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08G 77/18 (2013.01); C08G 77/20 (2013.01); C08G 77/24 (2013.01); C09D 183/04 (2013.01); G03F 7/0757 (2013.01); G03F 7/20 (2013.01); G03F 7/2002 (2013.01); G03F 7/40 (2013.01); H01L 21/027 (2013.01); H01L 21/02126 (2013.01); H01L 21/02216 (2013.01); H01L 21/02282 (2013.01); H01L 21/0332 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01);
Abstract

Method for producing coating composition applied to patterned resist film in lithography process for solvent development to reverse pattern. The method including: step obtaining hydrolysis condensation product by hydrolyzing and condensing hydrolyzable silane in non-alcoholic hydrophilic solvent; step of solvent replacement wherein non-alcoholic hydrophilic solvent replaced with hydrophobic solvent for hydrolysis condensation product. Method for producing semiconductor device, including: step of applying resist composition to substrate and forming resist film; step of exposing and developing formed resist film; step applying composition obtained by above production method to patterned resist film obtained during or after development in step, forming coating film between patterns; step of removing patterned resist film by etching and reversing patterns. Production method that exposure is performed using ArF laser (with wavelength of 193 nm) or EUV (with wavelength of 13.5 nm). Production method that development is negative development with organic solvent.


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