The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Aug. 08, 2018
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Kenji Kubota, Naka, JP;

Tooru Nishimura, Naka, JP;

Takashi Tamagawa, Naka, JP;

Kiyotaka Nakaya, Naka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); B32B 15/01 (2006.01); H01R 13/03 (2006.01); C25D 5/50 (2006.01); C25D 5/00 (2006.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01); C25D 3/46 (2006.01); C25D 3/56 (2006.01); C25D 5/12 (2006.01); C25D 5/34 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/505 (2013.01); B32B 15/01 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/46 (2013.01); C25D 3/562 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 5/617 (2020.08); C25D 5/619 (2020.08); C25D 7/00 (2013.01); H01B 1/02 (2013.01); H01B 1/026 (2013.01); H01R 13/03 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12944 (2015.01);
Abstract

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.


Find Patent Forward Citations

Loading…