The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Aug. 06, 2018
Applicant:
Lintec Corporation, Tokyo, JP;
Inventor:
Masakazu Ishikawa, Tokyo, JP;
Assignee:
LINTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/04 (2006.01); C09J 7/29 (2018.01); C09D 187/00 (2006.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B29C 65/04 (2013.01); C09D 187/00 (2013.01); C09J 5/06 (2013.01); C09J 11/04 (2013.01); C09J 2301/502 (2020.08);
Abstract
The invention provides a method of dismantling an adhesion structure including a pair of adherends made of the same material or different materials and a dielectric adhesive sheet interposed between the pair of adherends and bonding the pair of adherends to each other. The method includes: a first step of heating the dielectric adhesive sheet by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.