The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Feb. 02, 2021
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Yoko Nakabayashi, Nagano, JP;

Yuta Sakaguchi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); H01L 24/29 (2013.01); H05K 1/0298 (2013.01); H05K 3/422 (2013.01); H05K 3/4667 (2013.01); H05K 3/341 (2013.01); H05K 2201/09209 (2013.01);
Abstract

A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.


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