The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Dec. 11, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Haoyu Li, Boise, ID (US);
Everett A. McTeer, Eagle, ID (US);
Christopher W. Petz, Boise, ID (US);
Yongjun J. Hu, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 27/1157 (2017.01); H01L 21/311 (2006.01); H01L 27/11524 (2017.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 27/11556 (2013.01); H01L 21/31111 (2013.01); H01L 21/31122 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 29/40114 (2019.08); H01L 29/40117 (2019.08);
Abstract
A semiconductor device comprises a semiconductor material extending through a stack of alternating levels of a conductive material and an insulative material, and a material comprising cerium oxide and at least another oxide adjacent to the semiconductor material. Related electronic systems and methods are also disclosed.