The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Dec. 06, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Qintao Zhang, Mt Kisco, NY (US);

Samphy Hong, Saratoga Springs, NY (US);

David J. Lee, Poughkeepsie, NY (US);

Felix Levitov, Ballston Lake, NY (US);

Lei Zhong, Austin, TX (US);

Wei Zou, Lexington, MA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01J 37/317 (2006.01); H01L 21/3115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01J 37/3171 (2013.01); H01L 21/31144 (2013.01); H01L 21/31155 (2013.01); H01J 2237/3341 (2013.01);
Abstract

A method for performing an ion implantation process including providing a hardmask layer disposed atop a substrate, providing a photoresist layer disposed atop the hardmask layer and defining a pattern exposing a portion of the hardmask layer, performing a room temperature ion implantation process wherein an ion beam formed of an ionized first dopant species is directed onto the exposed portion of the hardmask layer to make the exposed portion more susceptible to ion etching or wet etching, performing an etching process wherein the exposed portion of the hardmask layer is etched away to expose an underlying portion of the substrate, and performing a high energy, hot ion implantation process wherein an ion beam formed of a ionized second dopant species is directed onto the exposed portion of the substrate.


Find Patent Forward Citations

Loading…