The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Jul. 13, 2017
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
William VanHoomissen, San Jose, CA (US);
Val Estrin, San Jose, CA (US);
Eric Jong, Mountain View, CA (US);
Assignee:
KLA Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 1/04 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B08B 7/02 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
B08B 1/04 (2013.01); B08B 7/02 (2013.01); H01L 21/67028 (2013.01); H01L 21/6735 (2013.01); H01L 21/67103 (2013.01); H01L 21/67769 (2013.01); H01L 21/67775 (2013.01); H01L 21/68 (2013.01); H01L 21/68735 (2013.01);
Abstract
A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.