The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Oct. 16, 2019
Applicant:

Tower Semiconductor Ltd., Migdal Haemek, IL;

Inventors:

Yakov Roizin, Afula, IL;

Victor Kairys, Karmiel, IL;

Ruth Shima-edelstein, Haifa, IL;

Assignee:

Tower Semiconductor Ltd., Migdal Haemek, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/205 (2006.01); H01L 29/417 (2006.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); H01L 23/34 (2006.01); H01L 31/113 (2006.01); H01L 29/82 (2006.01); H01L 31/0304 (2006.01); H01L 31/024 (2014.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/40 (2006.01); H01L 31/18 (2006.01); G01N 27/22 (2006.01); G01R 33/02 (2006.01); G01J 1/42 (2006.01); H01L 29/20 (2006.01); H01L 21/265 (2006.01); H01L 21/285 (2006.01); H01L 21/266 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7786 (2013.01); G01J 1/429 (2013.01); G01N 27/227 (2013.01); G01R 33/02 (2013.01); H01L 21/0217 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02271 (2013.01); H01L 21/02381 (2013.01); H01L 23/345 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/401 (2013.01); H01L 29/41725 (2013.01); H01L 29/42364 (2013.01); H01L 29/42372 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/66462 (2013.01); H01L 29/82 (2013.01); H01L 31/024 (2013.01); H01L 31/03048 (2013.01); H01L 31/1136 (2013.01); H01L 31/1848 (2013.01); H01L 21/02428 (2013.01); H01L 21/02433 (2013.01); H01L 21/266 (2013.01); H01L 21/2654 (2013.01); H01L 21/28575 (2013.01);
Abstract

An electrostatically controlled sensor includes a GaN/AlGaN heterostructure having a 2DEG channel in the GaN layer. Source and drain contacts are electrically coupled to the 2DEG channel through the AlGaN layer. A gate dielectric is formed over the AlGaN layer, and gate electrodes are formed over the gate dielectric, wherein each gate electrode extends substantially entirely between the source and drain contacts, wherein the gate electrodes are separated by one or more gaps (which also extend substantially entirely between the source and drain contacts). Each of the one or more gaps defines a corresponding sensing area between the gate electrodes for receiving an external influence. A bias voltage is applied to the gate electrodes, such that regions of the 2DEG channel below the gate electrodes are completely depleted, and regions of the 2DEG channel below the one or more gaps in the direction from source to drain are partially depleted.


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